Radiation Testing and Evaluation Issues for Modern Integrated Circuits

Changes in modern integrated circuit (IC) technologies have modified the way we approach and conduct radiation tolerance and testing of electronics. These changes include scaling of geometries, new materials, new packaging technologies, and overall speed and device complexity challenges. In this short course section, we will identify and discuss these issues as they impact radiation testing, modeling, and effects mitigation of modern integrated circuits. The focus will be on CMOS-based technologies, however, other high performance technologies will be discussed where appropriate. The effects of concern will be: Single Event Effects (SEE) and steady state total ionizing dose (TID) IC response. However, due to the growing use of optoelectronics in space systems issues concerning displacement damage testing will also be considered. This short course section is not intended to provide detailed “how-to-test” information, but simply provide a snapshot of current challenges and some of the approaches being considered.